Electronic packaging is the underlying technology behind the creation of small electronic devices such as cell phones, PDAs, and laptops. Packaging advances in this field have driven the miniaturization of consumer electronics. This is THE standard reference in the field, nearly 75% rewritten to reflect the tremendous advances that have taken place in the past five years. From the Back Cover: THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING―COMPLETELY UPDATED From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry.

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This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies. Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others. Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal. Book Description McGraw-Hill Education - Europe, United States, 2004. Condition: New. Language: English.

Brand New Book ***** Print on Demand *****. This is the most comprehensive reference in electronic packaging - completely updated. From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry.This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies.

Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others. Pasar Uang Antar Bank Pdf on this page. Book Description McGraw-Hill Education - Europe, United States, 2004. Condition: New. Language: English.

Brand New Book ***** Print on Demand *****.This is the most comprehensive reference in electronic packaging - completely updated. From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics.